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Ion Beam Etching
Ion beam etching technology provides a superior etching process over conventional chemical etching. With ion beam etching, there is no undercutting or cross-contaminantion, resulting in better overall RF circuit performance.
Dicing
MicroFab offers wafer dicing service on a wide variety of materials including Alumina, BEO, Aluminum Nitride, Quartz and others. Standard tolerance of +/- .001" ( 25.4 uM) with Special Tolerances of +/- .0005" (12.7 uM)
Plating
Electro-Plating Finishes Available:
- Soft Gold plating (wire bondable)
- Sulfamate Nickel plating (low stress)
- Copper Sulfate plating for thin film circuits
Micro Machining
Ion Etching and Photolithography tools are used to manufacture a wide variety of unique products for biomedical, optical and magnetic applications.
Some materials and applications
- Silicon Wafers Si – IR Chopper Disc, Micro-Fluidics
- Gallium Arsinide (GaAs)
- Alumina Titanium Carbon Al2O3TiC Magnetic Heads for Disk Drives
- Stainless Steel Molds Biomedical applications
- Cylinder Etching Gyroscope application
- Holographic Mirrors Optics and Laser
Etching depths, for products listed above, can range from a few thousand Angstroms to several microns. View the Ion Etch Rate document for etch rates on various materials.
