|
Substrate
Aluminum Nitride (AlN) and Berillium Oxide (BeO)
Sizes
As small as .020"x.020" in production quantity
Standard Thickness of .005",.010",.015" and .025"
High Power Laser Diode & Pumped Laser Diode submounts have thickness tolerances of +/- 10% Premium tolerances of 5% offered
Camber 0.0005"/inch
Metalization
Standard Ti/Pt/Au
Pre-deposited Solder (Sn, AuSn) available
Resistor Pads
TaN2 Resistors 50 and 100 ohms/sq. with tolerances of +/-1%
Features
0.25 mil (0.00025") Lines and Space Tolerances of +/- 0.05 mil (0.00005")
Thru-Hole and Wrap-Around capabilities
Our Thin Film Metalization offers:
- High Reliability
- Blister free
- Passes Mil-Std. 883C
Aluminum Nitride (AlN) Properties
Thermal Conductivity 170 W/mK (190 W/mK upon request)
Electrical resistivity >1014
Dielectric constant 8.6
Dielectric loss 0.0005
Surface Finish (Polished) <2 microinches
High Power Laser Diode & Pumped Laser Diode submounts have thermal expansion coefficient 4.2x10-6 (CTE)
Berillium Oxide (BeO) Properties
Thermal Conductivity 270 W/mK
Electrical resistivity >1014
Dielectric constant 6.5
Dielectric loss 0.0004
Surface Finish (Polished) <4 microinches
High Power Laser Diode & Pumped Laser Diode submounts have thermal expansion coefficient 9.0x10-6 (CTE)
|
